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NUF4310MN Low Capacitance 4-Line EMI Filter with ESD Protection in WDFN8 Package
This device is a 4 line EMI filter array for wireless applications. Greater than -25 dB attenuation is obtained at frequencies from 800 MHz to 4.0 GHz. The NUF4310MN has a cut-off frequency of 185 MHz. This WDFN package is specifically designed to enhance EMI filtering for low-profile or slim design electronics especially where space and height is a premium. It also offers ESD protection-clamping transients from static discharges. ESD protection is provided across all capacitors.
Features http://onsemi.com
1 Cd 2 Cd 3 Cd 4 Cd Cd Cd 5 Cd 6 Cd 7 8
* EMI Filtering and ESD Protection * Integration of 20 Discrete Components * Compliance with IEC61000-4-2 (Level 4) * WDFN Package, 1.6 x 1.0 mm * Moisture Sensitivity Level 1 * ESD Ratings: Machine Model = C *
>8 kV (Contact) [I/O Pins to GND]
(Top View)
8 1
Human Body Model = 3B This is a Pb-Free Device*
MARKING DIAGRAM
43MG G
Benefits
* Reduces EMI/RFI Emissions on a Data Line * Low Profile Package; Typical Height of 0.75 mm * Design-Friendly and Easy-to-Use Pin Configurations, * Integrated Solution Offers Cost and Space Savings in WDFN * * * * * * * *
Particularly for Portable Electronics Package Reduces Parasitic Inductances Which Offer a More "Ideal" Low Pass Filter Response Integrated Solution Improves System Reliability EMI Filtering and ESD Protection for Data Lines Keypad Interface and Protection for Portable Electronics Bottom Connector Interface for Mobile Handsets Notebook Computers and Digital Cameras LCD Display Interface in Mobile Handsets Camera Display Interface in Mobile Handsets
WDFN8 CASE 511AF
1
43 = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location)
PIN CONNECTIONS
1 4
Applications
8
5
ORDERING INFORMATION
Device NUF4310MNTAG Package WDFN8 (Pb-Free) Shipping 3000 / Tape & Reel
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2008
October, 2008 - Rev. 0
1
Publication Order Number: NUF4310MN/D
NUF4310MN
MAXIMUM RATINGS
Parameter ESD Discharge IEC61000-4-2 Operating Temperature Range Storage Temperature Range Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Contact Discharge Symbol VPP TOP TSTG TL Value 8.0 -40 to 85 -55 to 150 260 Unit kV C C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Parameter Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Resistance Capacitance (Notes 1 and 2) Cut-Off Frequency (Note 3) Symbol VRWM VBR IR RA Cd f3dB IR = 1.0 mA VRWM = 3.3 V IR = 10 mA VR = 2.5 V, f = 1.0 MHz Above this frequency, appreciable attenuation occurs 85 7.2 100 9.0 185 6.0 7.0 Test Conditions Min Typ Max 5.0 8.0 100 115 10.8 Unit V V nA W pF MHz
1. Measured at 25C. 2. Total Line Capacitance is two times the Diode Capacitance (Cd). 3. 50 W source and 50 W load termination.
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NUF4310MN
TYPICAL PERFORMANCE CURVES
(TA= 25C unless otherwise specified)
0 -5 INSERTION LOSS (dB) -10 S41 (dB) -15 -20 -25 -30 -35 -40 1.E+06 1.E+07 1.E+08 FREQUENCY (Hz) 1.E+09 1.E+10
0 -10 -20 -30 -40 -50 -60 1.E+06
1.E+07
1.E+08 FREQUENCY (Hz)
1.E+09
1.E+10
Figure 1. Typical Insertion Loss Characteristic
Figure 2. Typical Analog Crosstalk
2.0 NORMALIZED CAPACITANCE
110 108 106 RESISTANCE (W) 104 102 100 98 96 94 92 90 -40
1.5
1.0
0.5
0
0
1.0
2.0
3.0
4.0
5.0
-20
0
20
40
60
80
REVERSE VOLTAGE (V)
TEMPERATURE (C)
Figure 3. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance Cd at 2.5 V)
Figure 4. Typical Resistance over Temperature
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NUF4310MN
PACKAGE DIMENSIONS
WDFN8, 1.6x1.0, 0.4P CASE 511AF-01 ISSUE O
L L1 L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.10 AND 0.20 MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A2 b b2 D D2 E E2 e L L1 L2 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.15 0.25 0.13 0.23 1.60 BSC 0.79 0.89 1.00 BSC 0.15 0.25 0.40 BSC 0.15 0.25 --- 0.10 0.13 0.23
D
AB
0.10 C
0.05 C
10X
A (A2)
ALTERNATE CONSTRUCTION
0.05 C
NOTE 4 DETAIL B SEATING PLANE
SIDE VIEW e/2 e 1 4
A1
C
2X
L2 L E2
6X
2X
b2 8 D2
5
8X
b 0.10 C A B 0.05 C
NOTE 3
DETAIL A
BOTTOM VIEW
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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4
EEE EEE
DETAIL B
0.10 C
EEE EEE EEE
PIN ONE REFERENCE
E
ALTERNATE TERMINAL CONSTRUCTIONS
DETAIL A
TOP VIEW
EXPOSED Cu
MOLD CMPD
MOUNTING FOOTPRINT
PKG OUTLINE
0.94
0.35
8X
1.24 0.30
8X
1 0.40 PITCH
DIMENSIONS: MILLIMETERS
0.25
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
NUF4310MN/D

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